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TAKEX_Mini-G

Ultra-Compact Embedded Amplifier Photo Sensors

  • TAKEX Mini-G Series ultra-compact photo sensors offer through-beam, retroreflective, diffuse reflective, and convergent reflective sensing from 1 mm to 10 m.
  • The lineup provides red or infrared LEDs, NPN/PNP models, response within 0.35 ms, M3 mounting, and IP67 protection.
  • Brand TAKEX Takenaka Engineering Co., Ltd.
Features
  • Ultra-compact built-in design: Mini-G sensors provide compact head-on and side-on configurations for machine-integrated applications, with M3 screw mounting supported throughout the series.
  • Four sensing methods: The lineup includes through-beam, retroreflective, diffuse reflective, and convergent reflective models for different target, distance, and background conditions.
  • Through-beam sensing up to 10 m: GT3RSN and GT3RSPN use red LEDs and provide a 10 m detecting distance, with 1 m and 7 m infrared through-beam models also available.
  • Response within 0.35 ms: Main models provide a response time of 0.35 ms or less with selectable Light-ON or Dark-ON operation.
  • IP67 with stable sensing indication: All models provide IP67 protection and operation/stability indicators. NPN models additionally provide a stability output.
Specification
ItemSpec.
Product typeUltra-compact embedded amplifier photo sensor
Detection methodsThrough beam, retroreflective, diffuse reflective, convergent reflective
Power supply12–24VDC ±10%, ripple 10% or less
Control outputNPN or PNP open collector depending on model
Operation modeLight-ON / Dark-ON selectable
Response time0.35 ms or less
Light sourceRed or infrared LED depending on model
Operation indicatorRed LED
Stability indicatorGreen LED
Case materialPolyarylate
Lens materialPolycarbonate, polyarylate, or acrylic depending on model
Ambient light5,000 lx or less
Operating temperature−25 to +55°C, non-freezing
Ambient humidity35–85% RH, non-condensing
Protective structureIP67
WeightApprox. 50 g; through-beam transmitter and receiver approx. 50 g each

Specification notes

  • Model selection is based primarily on sensing method and range: Through-beam models cover 1, 7, or 10 m; retroreflective models cover 10–2,000 mm; diffuse reflective models cover 70, 200, 300, or 400 mm; and convergent reflective models cover 1–40 mm or 3–30 mm.
  • Stability output differs between NPN and PNP models: NPN models provide a stability output rated at 50 mA at 30VDC or less, while PNP models do not provide a stability output.
  • GT3RSN and GT7SN support GP1, GP2, GP3, and GP5-1 pinhole plates. Retroreflective models can use K-71, K-7, and S-25 reflectors, with detecting distance varying by reflector.
FAQ

Q1: What is the TAKEX Mini-G Series?
A: The Mini-G Series consists of ultra-compact embedded amplifier photo sensors designed for built-in machine applications and limited installation spaces.


Q2: What sensing methods are available?
A: The lineup includes through-beam, retroreflective, diffuse reflective, and convergent reflective sensing.


Q3: What is the maximum detecting distance?
A: GT3RSN and GT3RSPN through-beam models provide a maximum detecting distance of 10 m.


Q4: What light sources are available?
A: Red and infrared LED models are available depending on the sensing method and model.


Q5: Are NPN and PNP models available?
A: Yes. Major sensing configurations are available with either NPN or PNP open-collector output.


Q6: Do both NPN and PNP models provide a stability output?
A: No. NPN models provide a stability output, while PNP models do not.


Q7: What is the response time of the Mini-G Series?
A: Main models provide a response time of 0.35 ms or less.


Q8: Can Mini-G sensors be mounted with M3 screws?
A: Yes. All Mini-G Series models support M3 screw mounting.


Q9: Can pinhole plates be used with through-beam models?
A: Yes. GT3RSN and GT7SN support GP1, GP2, GP3, and GP5-1 pinhole plates, with detecting distance varying by aperture size.


Q10: What applications are suitable for the Mini-G Series?
A: Applications include general machinery, logistics, precision machinery, electronic components, automotive parts, food and pharmaceutical equipment, thread-break detection with GS5N, and parts-feeder material detection with GSZ3RSN.

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