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TAKEX_LD

Laser-Type Embedded Amplifier Photo Sensors

  • TAKEX LD Series laser photo sensors use a fine 650 nm red semiconductor laser for long-range and precision sensing.
  • The lineup includes through-beam models up to 20 m, polarized retroreflective models, and LD-S20R variable-focus reflective models covering 30–300 mm with an adjustable 1 mm spot.
  • Brand TAKEX Takenaka Engineering Co., Ltd.
Features
  • Fine red laser beam: The 650 nm red semiconductor laser provides a narrow sensing beam for detecting small objects through narrow gaps and holes.
  • Through-beam sensing up to 20 m: LD-T20R models provide sensing distances up to 20 m, with additional 15 m, 10 m, 7 m, 5 m, 3 m, and 700 mm configurations.
  • Variable-focus reflective sensing: LD-S20R and LD-S20RPN cover 30–300 mm and provide an approximately 1 mm adjustable laser spot from 80 to 300 mm.
  • NPN/PNP and laser-class options: The lineup offers NPN or PNP open-collector outputs, with Class 1 and Class 2 laser configurations depending on model.
  • 0.5 ms response: Main models provide a response time of 0.5 ms or less with selectable Light-ON/Dark-ON operation for high-speed precision sensing.

Specification
ItemSpec.
Product typeLaser-type embedded amplifier photo sensor
Detection methodsThrough beam, polarized retroreflective, variable-focus reflective
Power supply12–24VDC ±10%, ripple 10% or less
Control outputNPN or PNP open collector depending on model
Operation modeLight-ON / Dark-ON selectable
Response time0.5 ms or less
Light source650 nm red semiconductor laser
Laser classClass 1 or Class 2 depending on model
Operation indicatorRed or orange LED depending on model
Stability indicatorGreen LED
Ambient light5,000 lx or less
Operating temperature−10 to +55°C, non-freezing
Ambient humidity35–85% RH, non-condensing
Protective structureThrough-beam/polarized retroreflective: IP67;
LD-S20R Series: IP66

Specification notes

  • Through-beam models are selected by sensing range and laser class: Standard LD-T20R models mainly use Class 2 lasers, while C1 models use Class 1 lasers. Detecting ranges from 700 mm to 20 m are available.
  • LD-S20R provides variable-focus reflective sensing: It covers 30–300 mm and provides an approximately 1 mm spot over an 80–300 mm focusing range. A 1 mm black mark on a white background can be detected at 300 mm.
  • Avoid direct viewing of the laser beam or aiming it toward the human body. Through-beam models use a slow-start laser circuit, so laser emission begins shortly after power-up or release of the emission-stop input.
FAQ

Q1: What is the TAKEX LD Series?
A: The LD Series consists of embedded amplifier photo sensors using a fine red semiconductor laser for long-range, precision, and small-object detection.


Q2: What sensing methods are available?
A: The lineup includes through-beam, polarized retroreflective, and variable-focus reflective sensing.


Q3: What is the maximum detecting distance?
A: LD-T20R, LD-T20RPN, and selected connector models provide a maximum through-beam detecting distance of 20 m.


Q4: What light source does the LD Series use?
A: Main models use a 650 nm red semiconductor laser, with Class 1 or Class 2 configurations depending on model.


Q5: What object size can LD-T20R detect?
A: The standard target for LD-T20R is an opaque object with a diameter of Φ20 mm or larger.


Q6: What is the detecting distance of LD-M10R?
A: Detecting distance depends on the reflector. With the K-MT4 reflector, the detecting range is 1–7 m.


Q7: Can the laser spot of LD-S20R be adjusted?
A: Yes. LD-S20R provides an approximately 1 mm spot with a focusing range from 80 to 300 mm.


Q8: Can LD-S20R detect small marks?
A: Yes. At 300 mm, it can detect a 1 mm black mark on a white background under the specified conditions.


Q9: What is the response time of the LD Series?
A: Main models including LD-T20R, LD-M10R, and LD-S20R provide a response time of 0.5 ms or less.


Q10: What applications are suitable for the LD Series?
A: Applications include chip detection on lead frames, tape-feeder lift detection, hybrid substrate positioning, weld-joint detection, rubber-cap presence detection, and rolled-paper positioning.

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