CONVUM PPG Series | Square Pads for Chip & Micro Part Handling

• Ultra-Compact Square Design: Engineered for semiconductor and micro-parts with precise placement and stable pickup.
• Micro-Part Accuracy: Reliable gripping of chips, ICs, and tiny components to minimize shift and drops.
• Size Range (L × W): 0.55×0.55, 0.5×1.3, 0.8×1.6, 1.3×2.8, 2.0×2.8 mm.
• Materials embedded in features:
  • FKM (F, black w/ white dots): Heat- and chemical-resistant—suited for cleaning fluids and process chemicals.
  • Conductive FKM (FE, black): Conductive for ESD-controlled electronics/semiconductor lines.
• High-Speed Friendly: Lightweight construction for fast pick-and-place, sorting, and precision transfer.
• Applications: Post-dicing die handling, IC packaging/test stations, micro-electronic placement and alignment.

Q1: Which industries/stations are PPG pads for?
A: Semiconductor, electronics assembly, testing/sorting—any station requiring precise micro-part handling.

Q2: How do they differ from round pads?
A: The square contact improves edge alignment and positional accuracy for chips and micro parts.

Q3: Are they suitable for high-speed automation?
A: Yes. Their lightweight build supports fast operations; tune vacuum orifice and motion profiles for best stability.

Q4: How do I choose between FKM (F) and Conductive FKM (FE) materials?
A: FKM (F) prioritizes heat/chemical resistance; Conductive FKM (FE) adds conductivity for ESD-controlled environments.

Q5: What sizes are available?
A: 0.55×0.55, 0.5×1.3, 0.8×1.6, 1.3×2.8, 2.0×2.8 mm (L × W).