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TAKEX_DLN_IR

Infrared BGS/FGS Switchable Photo Sensors

  • TAKEX DLN Series infrared photo sensors use an invisible 850 nm infrared LED for BGS/FGS sensing.
  • DLN-S4V covers 10–100 mm, while DLN-S20MV reaches up to 300 mm.
  • Both provide NPN/PNP dual outputs, 0.5 ms response, distance adjustment, anti-interference, and IP67 protection.
  • Brand TAKEX Takenaka Engineering Co., Ltd.
Features
  • Invisible infrared sensing spot: The 850 nm infrared LED is suited to applications where a visible sensing spot is undesirable, including automatic faucets and gaming equipment.
  • Suitable for red-light absorbing targets: The infrared light source supports detection of materials and objects that absorb visible red light.
  • Switchable BGS/FGS operation: BGS ignores backgrounds beyond the setting distance, while FGS recognizes a stable background and detects changes caused by the target.
  • NPN/PNP dual outputs: Both models provide NPN and PNP open-collector outputs for flexible control-system integration.
  • 0.5 ms response and IP67 protection: DLN-S4V and DLN-S20MV provide 0.5 ms or less response, IP67 protection, and automatic mutual-interference prevention.
Specification
ItemSpec.
Product typeInfrared BGS/FGS switchable photo sensor
Series modelsDLN-S4V
DLN-S20MV
Detection methodFixed-field reflective
Detection modeBGS / FGS selectable
DLN-S4V detecting distance10–100 mm
DLN-S20MV detecting distance10–200 mm when set from 90–200 mm;
20–300 mm when set from 201–300 mm
Power supply12–24VDC, ripple 10% or less
Current consumptionDLN-S4V: 16 mA or less;
DLN-S20MV: 18 mA or less
Operation modeLight-ON / Dark-ON selectable
Light sourceInfrared LED, 850 nm
Response time0.5 ms or less
Hysteresis5% or less
Operation indicatorOrange LED
Stability indicatorGreen LED
Case materialPBT
Lens materialPolycarbonate
Ambient light5,000 lx or less
Operating temperature−25 to +55°C, non-freezing
Ambient humidity35–85% RH, non-condensing
Protective structureIP67

Specification notes

  • DLN-S4V and DLN-S20MV are primarily differentiated by sensing range. DLN-S4V covers 10–100 mm, while DLN-S20MV has a 90–300 mm setting range and detects targets up to 300 mm.
  • DLN-S4V specifications use 50 × 50 mm white paper, while DLN-S20MV uses 100 × 100 mm white paper. Turning the distance adjustment beyond the factory setting may extend the detecting distance beyond the specified range.
  • NPN and PNP outputs must not be used simultaneously. When two sensors are installed adjacent to each other, operation should be verified under the actual installation and target conditions.
FAQ

Q1: What is the TAKEX DLN Series infrared type?
A: It is a fixed-field reflective photo sensor series using an 850 nm infrared LED with selectable BGS and FGS operation.


Q2: What models are available?
A: The lineup consists of DLN-S4V for short-range sensing and DLN-S20MV for middle-range sensing.


Q3: What is the detecting range of DLN-S4V?
A: DLN-S4V detects from 10 to 100 mm, with a setting range of 24 to 100 mm.


Q4: What is the maximum detecting distance of DLN-S20MV?
A: DLN-S20MV can detect targets up to 300 mm, with a setting range of 90 to 300 mm.


Q5: How does the infrared type differ from the standard DLN Series?
A: The infrared type uses an invisible 850 nm infrared LED and is suitable for targets that absorb visible red light.


Q6: Is it suitable where a visible sensing spot is undesirable?
A: Yes. It is intended for applications such as automatic faucets and gaming equipment where an invisible sensing spot is preferred.


Q7: Can BGS and FGS operation be selected?
A: Yes. BGS suppresses backgrounds beyond the setting distance, while FGS detects targets against a stable background.


Q8: Are both NPN and PNP outputs provided?
A: Yes. Both outputs are provided, but they must not be used simultaneously.


Q9: What are the response time and protection rating?
A: Both models provide a response time of 0.5 ms or less and IP67 protection.


Q10: What applications are suitable for the infrared DLN Series?
A: Applications include silicon wafer and wafer carrier detection, electronic components, printing processes, CD presence, tile and bobbin detection, no-touch switches, and targets that absorb red light.

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