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TAKEX_UM

3.5 mm Ultra-Thin Miniature Photo Sensors

  • TAKEX UM Series ultra-miniature embedded amplifier photo sensors are only 3.5 mm thick with a volume under 0.8 cm³.
  • The lineup offers through-beam sensing up to 1 m plus diffuse and convergent reflective models, with NPN/PNP and in-line sensitivity adjustment options.
  • Brand TAKEX Takenaka Engineering Co., Ltd.
Features
  • 3.5 mm ultra-thin design: The embedded amplifier sensor is only 3.5 mm thick with a volume under 0.8 cm³ for integration into small devices and confined spaces.
  • Through-beam sensing up to 1 m: Through-beam models provide 150 mm, 500 mm, and 1,000 mm detecting distances for different machine layouts.
  • Three sensing methods: The lineup includes through-beam, 2–30 mm and 2–50 mm diffuse reflective, and 5–30 mm convergent reflective models.
  • NPN/PNP and sensitivity options: NPN and PNP configurations are available, while V-suffix models provide in-line sensitivity adjustment.
  • Designed for built-in installation: Direct screw mounting and an ultra-thin housing suit IC sticks, PCBs, chip mounters, and other equipment with restricted installation space.
Specification
ItemSpec.
Product type3.5 mm ultra-thin miniature embedded amplifier photo sensor
Current model count38
Sensor thickness3.5 mm
Sensor volumeLess than 0.8 cm³
Detection methodsThrough beam, diffuse reflective, convergent reflective
Through-beam detecting distance150 mm, 500 mm, 1,000 mm
Diffuse reflective detecting distance2–30 mm, 2–50 mm
Convergent reflective detecting distance5–30 mm
Through-beam power supply24VDC
Reflective-model power supply12–24VDC
Control outputNPN or PNP depending on model
Operation modeLight-ON or Dark-ON depending on model
Operation indicatorRed LED
Stability indicatorGreen LED
Protective structureIP64
Ambient light3,000 lx or less
Operating temperature−25 to +55°C, non-freezing
Ambient humidity35–85% RH, non-condensing

Specification notes

  • Power supply varies by sensing type: Current through-beam models are primarily listed for 24VDC, while diffuse and convergent reflective models operate from 12–24VDC. Check the individual model when wiring.
  • V-suffix models include an in-line sensitivity adjustment. On through-beam versions, the adjustment is located on the receiver side, with a fixed 300 mm distance between the sensor and adjustment unit.
  • PNP models use an in-line output-conversion configuration depending on model. Sensors can be mounted directly to the machine, while optional UM-V1 is available for mounting the in-line sensitivity unit.
FAQ

Q1: What is the TAKEX UM Series?
A: This UM Series consists of ultra-thin miniature embedded amplifier photo sensors measuring only 3.5 mm thick for integration into compact equipment.


Q2: Is this the same as the UM-T51 Series?
A: No. This is the 3.5 mm ultra-thin UM Series covering T15, T50, T100, R3, R5, and Z3 models. The UM-T51 lineup belongs to a separate series page.


Q3: What is the maximum detecting distance?
A: UM-T100 through-beam models provide a maximum detecting distance of 1 m.


Q4: What sensing methods are available?
A: The lineup includes through-beam, diffuse reflective, and convergent reflective sensing.


Q5: Are both NPN and PNP outputs available?
A: Yes. The current lineup includes both NPN and PNP output configurations.


Q6: Which models provide sensitivity adjustment?
A: Models containing V in the suffix provide in-line sensitivity adjustment, including UM-T15TV, UM-T50SV, UM-R3TV, UM-R5TV, and UM-Z3SV.


Q7: What is the protection rating?
A: Current UM Series models are rated IP64.


Q8: What is the detecting range of UM-R5?
A: UM-R5 diffuse reflective models provide 2–50 mm sensing with a 50 × 50 mm white drawing paper reference target.


Q9: Is the UM Series suitable for built-in installation?
A: Yes. Its 3.5 mm thickness and volume below 0.8 cm³ make it suitable for compact equipment and restricted installation spaces.


Q10: What applications are suitable for the UM Series?
A: Applications include IC detection in transparent sticks, resist-liquid level sensing, PCB detection in chip mounters, and paper-arrival detection in office equipment.

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