Q1: What workpieces are best suited for PA pads?
A: Smooth, easily deformable thin materials such as paper, plastic films, and thin sheets—where low marking and stable pickup are required.
Q2: What pad materials are available?
A: N (NBR) / S (Silicone) / F (FKM) / NE (Conductive NBR) / SE (Conductive Silicone) for general duty, clean handling, chemical/heat resistance, and ESD-sensitive processes.
Q3: How do I choose the right size?
A: Select ø5–50 mm based on effective contact area and load. For larger or more porous pieces, use a larger diameter to improve sealing and holding stability.
Q4: Will the thin lip leave marks?
A: The thin lip spreads contact pressure to reduce impressions. For highly delicate surfaces, choose S/SE (Silicone) to minimize marking.
Q5: Which material should I use for ESD-critical applications?
A: NE or SE pads provide conductive properties that help control surface potential and reduce ESD risks.
Q6: What about high temperature or chemical exposure?
A: F (FKM) is recommended for better heat and chemical resistance. Always verify media compatibility with a small trial.
Q7: Will these pads affect my line's cycle time?
A: The fast-start sealing and rapid lip recovery typically reduce cycle time. For ultra-short cycles, validate vacuum build time on your tool.
Q8: Can PA pads handle rough or porous surfaces?
A: PA is tuned for smooth surfaces. For porous/rough materials, consider thicker-lip or bellows-type pads to improve sealing.
Q9: How should I clean and maintain the pads?
A: Wipe with lint-free cloths and mild cleaners to remove dust/adhesives; avoid prolonged solvent soaking. Inspect lip wear/cracks and replace as needed.
Q10: Advantages over general cup-type pads?
A: The thin-lip geometry lowers deformation and marking on delicate work, enabling smoother pick-and-place and release—especially in SMT and labeling tasks.