CONVUM RA Series | Mark-Free Pads for Glass & Chip Handling

• Mark-Reducing Surface Treatment: Specially treated contact surface minimizes suction marks and transfer, preserving finish quality.
• For High-Appearance Parts: Ideal for semiconductor wafers/dies, glass panels, optical lenses where no marks are allowed.
• Deployable Across Pad Families: Can be applied to multiple pad geometries (flat, bellows, oval, etc.) to fit diverse grippers and stations.
• Material Options (Code | Material | Key traits):
  • F | FKM (Fluoroelastomer): Heat/chemical resistant, for general mark-free handling in process-chemical environments.
  • FE | Conductive FKM: Combines mark-free performance with ESD conductivity for static-sensitive lines.
• Yield-Focused: Cuts rework/cleaning time and improves cosmetic yield and consistency.
• Applications: Wafer/die handling, coated glass pick-and-place, lens/optics transfer, display module assembly.

Q1: What's the key difference vs. standard pads?
A: RA uses a mark-reducing surface treatment to suppress suction marks and print-through; standard pads are more likely to leave traces on high-spec surfaces.

Q2: Which lines benefit most from RA pads?
A: Semiconductor, glass, and optics processes—or any station with strict cosmetic controls (e.g., pre-inspection, pre-lamination).

Q3: How do I choose between F and FE materials?
A: F (FKM) prioritizes heat/chemical resistance with mark-free performance; FE (Conductive FKM) adds ESD conductivity for static-controlled environments.

Q4: Are RA pads limited to a single pad shape?
A: No. RA is a surface treatment that can be applied across multiple pad designs—select geometry by part shape and tool clearance.

Q5: Any recommendations before deployment?
A: Run a on-tool trial with real parts to confirm surface compatibility and vacuum holding; for coated or mirror-finish parts, also verify cleanliness and residue.