CONVUM PE-S Vacuum Pads｜ESD-Safe Pads for Thin & Flexible Films

• No-Warp Handling for Ultra-Thin Media: Engineered support and sealing keep copper foil, films, and FPC flat during pickup and release, minimizing curl and plastic deformation.
• Built-In ESD Safety: Conductive rubber dissipates charge through the material itself—no extra coating required—for stable, long-term anti-static performance.
• Quick Snap-Fit Mounting: Tool-less replacement shortens downtime and improves line availability.
• Clean-Process Friendly: Low marking and low residue for electronics/semiconductor handling before and after lamination or inspection.
• Applications: Copper-foil/film singulation & transfer, FPC loading/unloading, semiconductor packaging trays, optics and precision electronics lines.

Q1: How do PE-S pads differ from standard vacuum pads?
A: PE-S combines anti-deformation with ESD control: tailored support prevents warping of ultra-thin media, while the conductive rubber provides coating-free static dissipation.

Q2: What processes and parts are they designed for?
A: Copper foil, electronic films, FPC, and semiconductor packaging carriers—stations that demand planarity and ESD control (pre/post lamination, singulation, inspection transfer).

Q3: Do they require an additional anti-static coating?
A: No. Conductivity is built into the compound, avoiding performance drift associated with coatings.

Q4: Any recommendations before deployment?
A: Run on-tool trials to validate holding force, tension paths, and release rebound; for ultra-thin media, tune vacuum orifice and blow-off timing.

Q5: Are they compatible with ionizers?
A: Yes. Using ionizing blowers/bars further accelerates charge neutralization and helps reduce debris attraction.